US Patent Issued to TONG HSING ELECTRONIC INDUSTRIES on Nov. 3 for "Chip package structure and method for producing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,838, issued on Nov. 3, was assigned to TONG HSING ELECTRONIC INDUSTRIES LTD. (Taipei City, Taiwan).

"Chip package structure and method for producing the same" was invented by Li-Chun Hung (Hsin-Chu County, Taiwan), Jui-Hung Hsu (Hsin-Chu County, Taiwan) and Chien-Chen Lee (Hsin-Chu County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A chip package structure and a method for producing the same are provided. The method at least includes: providing a substrate; placing a chip upside-down on the substrate; forming bonding wires coupled with the chip and the substrate; forming a support body on the substrate; providing at least one reflecting me...