US Patent Issued to TONG HSING ELECTRONIC INDUSTRIES on May 19 for "Dual-side heat-dissipation package structure and package structure" (Taiwanese Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,517, issued on May 19, was assigned to TONG HSING ELECTRONIC INDUSTRIES LTD. (Taipei City, Taiwan).

"Dual-side heat-dissipation package structure and package structure" was invented by Ting-An Yang (Taipei City, Taiwan) and Chi-Wen Huang (Taipei City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure includes a board, an inner metal layer, a metal piece, and a buffering conductor. The inner metal layer is disposed on an inner side of the board and includes a connection region. The metal piece has a first segment being spaced apart from and facing toward the connection region. The first segment and the connection segment have u...