US Patent Issued to TONG HSING ELECTRONIC INDUSTRIES on June 2 for "Optical package structure and optical chip thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., June 2 -- United States Patent no. 12,648,259, issued on June 2, was assigned to TONG HSING ELECTRONIC INDUSTRIES LTD. (Taipei City, Taiwan).

"Optical package structure and optical chip thereof" was invented by Yu-Hsiang Liu (Taipei City, Taiwan) and Li-Chun Hung (Hsin-Chu County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An optical package structure includes a substrate, an optical chip disposed on the substrate, a ring-shaped supporting layer disposed on the optical chip, a light-permeable layer disposed on the ring-shaped supporting layer, and an encapsulant formed on the substrate. The optical chip has a pressure channel arranged therein. Two ends of the pressure channel are ...