ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,286, issued on July 21, was assigned to TONG HSING ELECTRONIC INDUSTRIES LTD. (Taipei City, Taiwan).
"Chip packaging structure" was invented by Jui-Hung Hsu (Taipei City, Taiwan), Li-Chun Hung (Taipei City, Taiwan) and Chien-Chen Lee (Taipei City, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A chip packaging structure is provided. The chip packaging structure includes a first substrate, an image sensing chip, a supporting member, a second substrate, a grating film, and an encapsulant. The image sensing chip is disposed on an upper surface of the first substrate and has an image sensing region. The supporting member is disposed on an upper s...