ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,563,850, issued on Feb. 24, was assigned to TONG HSING ELECTRONIC INDUSTRIES LTD. (Taipei City, Taiwan).
"Optical package structure" was invented by Chien-Hung Lin (Taipei City, Taiwan), Bae-Yinn Hwang (Taipei City, Taiwan), Wen-Fu Yu (Taipei City, Taiwan) and Wei-Li Wang (Taipei City, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "An optical package structure includes a light transmittable member, a bonding structural member, and an optical element. The bonding structural member includes a first bonding layer and a second bonding layer to form a light-scattering structure. The first bonding layer is connected to a bonding surface of the light tr...