US Patent Issued to TONG HSING ELECTRONIC INDUSTRIES on Feb. 17 for "Wireless transistor outline package structure" (Taiwanese Inventors)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,557,678, issued on Feb. 17, was assigned to TONG HSING ELECTRONIC INDUSTRIES LTD. (Taipei, Taiwan).

"Wireless transistor outline package structure" was invented by Hung-Hsiang Yeh (Taipei, Taiwan) and Jia-Yi Wu (Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wireless transistor outline (TO) package structure includes a carrying module, a chip and a lead frame both mounted on the carrying module, a sheet-like bonding module mounted on the chip and the lead frame in a flip chip manner, and an encapsulant that covers the above components therein. A connection pad of the chip and a connection segment of the lead frame are coplanar with each...