US Patent Issued to TONG HSING ELECTRONIC INDUSTRIES on April 21 for "Semiconductor package structure and method for producing the same" (Taiwanese Inventor)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,639, issued on April 21, was assigned to TONG HSING ELECTRONIC INDUSTRIES LTD. (Taipei City, Taiwan).

"Semiconductor package structure and method for producing the same" was invented by Li-Chun Hung (Hsin-Chu County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package structure and a method for producing the same are provided. The package structure includes a support substrate, a chip body disposed on the support substrate, a metal lead connected between the support substrate and the chip body, a spacer element disposed on the chip body, and a light-transmitting plate disposed on the chip body through the spacer element. T...