US Patent Issued to TONG HSING ELECTRONIC INDUSTRIES on April 14 for "Sensor package structure and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,420, issued on April 14, was assigned to TONG HSING ELECTRONIC INDUSTRIES LTD. (Taipei City, Taiwan).

"Sensor package structure and manufacturing method thereof" was invented by Yu-Hsiang Liu (Taipei City, Taiwan) and Li-Chun Hung (Hsin-Chu County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A sensor package structure and a manufacturing method thereof are provided. The sensor package structure includes a substrate, a first solder mask layer, a convex structure, a sensing chip, and an engaging layer. The first solder mask layer is disposed on the substrate. The convex structure is disposed on the first solder mask layer. The convex struct...