US Patent Issued to TOKYO SEIMITSU on June 30 for "Dicing apparatus and method for controlling dicing apparatus" (Japanese Inventor)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,667,926, issued on June 30, was assigned to TOKYO SEIMITSU Co. LTD. (Tokyo).

"Dicing apparatus and method for controlling dicing apparatus" was invented by Takashi Tamogami (Hachioji, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A dicing apparatus that performs dicing of a street of a workpiece attached to a dicing tape via a die attach film and cuts the workpiece and the die attach film along the street includes a cross-sectional profile acquisition unit that acquires a cross-sectional profile of a machined groove formed through the dicing, a cut amount detection unit that detects a cut amount into the die attach film obtained through the dicin...