US Patent Issued to TOKYO OHKA KOGYO on June 16 for "Metal residue removing liquid, metal residue removing method, and metal wiring manufacturing method" (Japanese Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,655,370, issued on June 16, was assigned to TOKYO OHKA KOGYO Co. LTD. (Kawasaki, Japan).

"Metal residue removing liquid, metal residue removing method, and metal wiring manufacturing method" was invented by Ivan Ryzhii (Kawasaki, Japan), Mai Sugawara (Kawasaki, Japan) and Yugeng Wu (Kawasaki, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A metal residue removing liquid including a mixed solvent containing a first organic solvent and a second organic solvent, a salt of a base containing no metal ions and hydrofluoric acid, and water, in which the first organic solvent is diethylformamide, and the mixed solvent has a value of 0.6 or more, which is ...