US Patent Issued to TOKYO OHKA KOGYO on July 28 for "Polymerizable composition and manufacturing method for element-mounted substrate" (Japanese Inventor)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,692,380, issued on July 28, was assigned to TOKYO OHKA KOGYO Co. LTD. (Kawasaki, Japan).

"Polymerizable composition and manufacturing method for element-mounted substrate" was invented by Teruhiro Uematsu (Kawasaki, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A polymerizable composition and a manufacturing method for an element-mounted substrate using the polymerizable composition. The polymerizable composition includes a water-soluble polymer, a nitrogen-containing monofunctional (meth)acrylic monomer, and a polymerization initiator. The composition is used to restrict a region where a sealing agent can flow in a sealing step in which at least...