US Patent Issued to TOKYO OHKA KOGYO on July 28 for "Method for suppressing collapse of three-dimensional structure" (American, Japanese Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,692,412, issued on July 28, was assigned to TOKYO OHKA KOGYO Co. LTD. (Kawasaki, Japan).

"Method for suppressing collapse of three-dimensional structure" was invented by Fusayo Saeki (Hillsboro, Ore.) and Kazumasa Wakiya (Kawasaki, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for suppressing collapse of a three-dimensional structure which can hydrophobize a surface of a three-dimensional structure on a substrate, regardless of a material of the substrate and a material of the three-dimensional structure, and can suppress collapse of the three-dimensional structure on the substrate, as a result of hydrophobization, a surface treatment li...