US Patent Issued to Tokyo Ohka Kogyo on July 21 for "Semiconductor device production method" (Japanese Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,420, issued on July 21, was assigned to Tokyo Ohka Kogyo Co. Ltd. (Kawasaki, Japan).

"Semiconductor device production method" was invented by Yubun Kikuchi (Kawasaki, Japan), Yoshihiro Yamada (Kawasaki, Japan) and Ryuma Mizusawa (Kawasaki, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for efficiently producing circuit patterns (semiconductor devices) that allows for effortless pickup of circuit patterns after dicing. The method includes producing a semiconductor substrate with circuit patterns formed on a first surface; forming a first laminate by bonding a first support through a first adhesive layer to the first surface; forming a ...