US Patent Issued to Tokyo Institute of Technology on Aug. 4 for "Electrostatic attraction device and electrostatic adsorption method" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,961, issued on Aug. 4, was assigned to Tokyo Institute of Technology (Tokyo).

"Electrostatic attraction device and electrostatic adsorption method" was invented by Shigeki Saito (Tokyo), Tomohiro Ryo (Tokyo), Yuki Taoka (Tokyo) and Sanchuan Xu (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "The adsorptive power and load capacity of an electrostatic chuck is vastly improved by maintaining an optimal state for in-plane stress produced at the interface between an adsorption surface and an object. The electrostatic adsorption module of the invention comprises a tip member having a bipolar adsorption surface and a support member that supports the ti...