ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,442, issued on Sept. 8, was assigned to Tokyo Electron Ltd. (Tokyo).
"Process system, method, and substrate chuck" was invented by Matthew Charles Gwinn (Winchendon, Mass.).
According to the abstract* released by the U.S. Patent & Trademark Office: "An embodiment apparatus includes a processing chamber and an equipment housing; a processing tool in the equipment housing with a process nozzle projecting into the processing chamber; a substrate chuck for supporting a wafer disposed in the processing chamber. The apparatus includes a docking station in the processing chamber configured to reset a temperature of the substrate chuck when the wafer is docked in a docking position; and ...