US Patent Issued to Tokyo Electron on Sept. 8 for "Multi-material chuck" (New York Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,450, issued on Sept. 8, was assigned to Tokyo Electron Ltd. (Tokyo).

"Multi-material chuck" was invented by Christopher Netzband (Albany, N.Y.) and Adam Gildea (Albany, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Conformal semiconductor chucks are disclosed. The semiconductor chucks can include a first portion comprising a first vacuum pad. The semiconductor chucks can include a second portion exhibiting greater compliance than either of the first portion or a third portion. The semiconductor chucks can include the third portion comprising a second vacuum pad."

The patent was filed on Oct. 3, 2023, under Application No. 18/376,359.

*For fu...