US Patent Issued to Tokyo Electron on Sept. 22 for "Wafer cleaning method and system using heated functional plate" (New York Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,585, issued on Sept. 22, was assigned to Tokyo Electron Ltd. (Tokyo).

"Wafer cleaning method and system using heated functional plate" was invented by Peter Delia (Albany, N.Y.) and Ronald Nasman (Albany, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wafer processing method and system are provided. The wafer processing system includes a controller configured to control a dispense nozzle of the wafer processing system to dispense distilled IPA liquid onto a semiconductor wafer in a processing space between two plates of the wafer processing system. The controller is further configured to control one or more heating elements of one of the two...