ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,590, issued on Sept. 22, was assigned to Tokyo Electron Ltd. (Tokyo).
"Substrate processing apparatus and substrate processing method" was invented by Gentaro Goshi (Koshi City, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing apparatus includes: a batch processor configured to collectively process a lot including plural substrates; a single-wafer processor configured to process the substrates included in the lot one by one; and a transport portion configured to deliver the substrates one by one between the batch processor and the single-wafer processor. The batch processor includes a processing tank configured to store a...