US Patent Issued to Tokyo Electron on Sept. 1 for "Method for processing a substrate" (New York Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,414, issued on Sept. 1, was assigned to Tokyo Electron Ltd. (Tokyo).

"Method for processing a substrate" was invented by Yen-Tien Lu (Albany, N.Y.) and Eric Chih-Fang Liu (Albany, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for processing a substrate includes forming a first mask over a mask line and forming a patterned mask by patterning a mask layer using the first mask as an etch mask. The first mask extending over sidewalls of the mask line and the mask layer is under the mask line. The method further includes forming a pillar and a line under the pillar from a target layer with an etch process by using the patterned mask layer ...