ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,697, issued on Oct. 6, was assigned to Tokyo Electron Ltd. (Tokyo).
"Substrate liquid processing method, and recording medium" was invented by Keiichi Fujita (Kikuchi-gun, Japan) and Takashi Tanaka (Kikuchi-gun, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate liquid processing method includes preparing a substrate having a recess on a surface thereof, a seed layer being formed on a surface of the recess; bringing a first pretreatment liquid, containing a reducing agent, a pH adjuster, and an additive configured to accelerate or inhibit an electroless plating reaction, into contact with the seed layer; and precipitating, after the bri...