US Patent Issued to Tokyo Electron on Oct. 27 for "Substrate processing apparatus and substrate processing method" (Japanese Inventor)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,773,708, issued on Oct. 27, was assigned to Tokyo Electron Ltd. (Tokyo).

"Substrate processing apparatus and substrate processing method" was invented by Akira Fujita (Kumamoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing apparatus includes a substrate holder, a rotational driver configured to rotate the substrate holder, and an ejection part configured to eject a processing liquid toward a liquid landing point of the substrate. The ejection part includes a plurality of nozzles that is different from each other in at least one of a first angle Theta or a second angle Phi. A circle is defined. An angle formed by a straight...