US Patent Issued to Tokyo Electron on Oct. 27 for "Substrate processing apparatus, substrate processing method, and substrate manufacturing method" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,875, issued on Oct. 27, was assigned to Tokyo Electron Ltd. (Tokyo).

"Substrate processing apparatus, substrate processing method, and substrate manufacturing method" was invented by Hayato Tanoue (Kikuchi-gun, Japan), Kento Araki (Kikuchi-gun, Japan), Yohei Yamashita (Kikuchi-gun, Japan) and Gousuke Shiraishi (Kikuchi-gun, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing apparatus configured to process a combined substrate in which a first substrate and a second substrate are bonded to each other includes a substrate holder configured to hold the combined substrate; a laser radiating unit configured to radiate laser light...