ALEXANDRIA, Va., May 5 -- United States Patent no. 12,618,151, issued on May 5, was assigned to Tokyo Electron Ltd. (Tokyo).
"Substrate processing apparatus" was invented by Kuniyasu Sakashita (Oshu, Japan) and Tosihiko Jo (Nirasaki, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing apparatus includes: an inner cylinder having a first region formed inside the inner cylinder to accommodate a substrate; an outer cylinder provided outside the inner cylinder with a second region interposed between the inner cylinder and the outer cylinder and including an exhaust port formed in an end portion of a sidewall of the outer cylinder; a nozzle configured to discharge a gas to the first region...