US Patent Issued to Tokyo Electron on May 26 for "Wafer bonding process with reduced overlay distortion" (New York, Texas Inventors)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,642,013, issued on May 26, was assigned to Tokyo Electron Ltd. (Tokyo).

"Wafer bonding process with reduced overlay distortion" was invented by Christopher Michael Netzband (Albany, N.Y.) and Nathan Ip (Austin, Texas).

According to the abstract* released by the U.S. Patent & Trademark Office: "An embodiment method includes determining an upper vacuum condition, a lower vacuum condition, a bonding gap distance, and a striker pressure condition based on measuring residual distortions from a previously bonded wafer. The method includes applying the upper vacuum condition to an upper wafer using an upper wafer holder, the upper vacuum condition applied to a backside of the upper wafer, an...