US Patent Issued to Tokyo Electron on May 19 for "Substrate support and substrate processing device" (Japanese Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,465, issued on May 19, was assigned to Tokyo Electron Ltd. (Tokyo).

"Substrate support and substrate processing device" was invented by Akira Nagayama (Miyagi, Japan), Atsushi Kawabata (Miyagi, Japan), Masato Takayama (Miyagi, Japan), Koji Kawanishi (Miyagi, Japan) and Takeshi Akao (Miyagi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure provides a substrate support. The substrate support comprises: a base; a first dielectric portion, disposed on the base, having a substrate support portion on which a substrate is mounted; and a second dielectric portion, disposed around the first dielectric portion, having an edge ring su...