US Patent Issued to Tokyo Electron on May 19 for "Substrate processing method" (Japanese Inventor)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,633,497, issued on May 19, was assigned to Tokyo Electron Ltd. (Tokyo).

"Substrate processing method" was invented by Morihito Inagaki (Yamanashi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing method includes providing a substrate processing apparatus including a vacuum container, a rotary table that includes a placement surface on which a plurality of substrates is disposed, and rotates the plurality of substrates, a plasma generator that includes an antenna and generates a plasma in the vacuum container, and a first driving unit that moves the antenna; storing ignition condition information that associate a process conditi...