US Patent Issued to Tokyo Electron on May 19 for "Substrate processing apparatus, substrate processing method and storage medium" (Japanese Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,450, issued on May 19, was assigned to Tokyo Electron Ltd. (Tokyo).

"Substrate processing apparatus, substrate processing method and storage medium" was invented by Teruhiko Kodama (Kumamoto, Japan), Yuzo Ohishi (Kumamoto, Japan) and Yoshitaka Matsuda (Kumamoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing apparatus includes: a substrate holder configured to hold a substrate while being locally superimposed on a back surface of the substrate; a light irradiator configured to irradiate the back surface with light so as to remove an organic substance on the back surface of the substrate; a light shielding member provided ...