US Patent Issued to Tokyo Electron on May 19 for "Method and single wafer processing system for processing of semiconductor wafers" (New York Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,629,725, issued on May 19, was assigned to Tokyo Electron Ltd. (Tokyo).

"Method and single wafer processing system for processing of semiconductor wafers" was invented by Shan Hu (Albany, N.Y.), Peter D'Elia (Albany, N.Y.) and Ronald Nasman (Albany, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Improved processing systems and methods are provided for wet and dry processing of a semiconductor wafer. Provided is an enclosed chamber for processing a semiconductor wafer within a processing space and a drainage system for directing processing fluids out of the processing space. The enclosed chamber includes a top plate and a bottom plate, which physical...