US Patent Issued to Tokyo Electron on May 12 for "Film forming method and film forming apparatus" (Japanese, American Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,624,444, issued on May 12, was assigned to Tokyo Electron Ltd. (Tokyo).

"Film forming method and film forming apparatus" was invented by Nobuo Matsuki (Nirasaki, Japan), Yoshinori Morisada (Nirasaki, Japan), Takayuki Komiya (Nirasaki, Japan), Satoru Kawakami (Nirasaki, Japan), Taro Ikeda (Nirasaki, Japan) and Toshihiko Iwao (Austin, Texas).

According to the abstract* released by the U.S. Patent & Trademark Office: "A film forming method forms a film on a substrate by plasma in a processing container including a stage configured to hold the substrate thereon, wherein the film forming method includes: (a) a step of supplying a raw material gas and a reaction gas as a processing gas to t...