US Patent Issued to Tokyo Electron on May 12 for "Bonding apparatus, bonding system, and bonding method" (Japanese Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,614, issued on May 12, was assigned to Tokyo Electron Ltd. (Tokyo).

"Bonding apparatus, bonding system, and bonding method" was invented by Yutaka Yamasaki (Koshi, Japan) and Takashi Terada (Koshi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A bonding apparatus configured to bond a first substrate and a second substrate includes a first holder configured to hold the first substrate; a second holder disposed to face the first holder, and configured to hold the second substrate; two imaging units each including a first imaging device configured to image a first alignment mark formed on a bonding surface of the first substrate and a second imag...