US Patent Issued to Tokyo Electron on March 31 for "Substrate processing apparatus and substrate processing method" (Japanese Inventors)

ALEXANDRIA, Va., March 31 -- United States Patent no. 12,591,180, issued on March 31, was assigned to Tokyo Electron Ltd. (Tokyo).

"Substrate processing apparatus and substrate processing method" was invented by Yoji Sakata (Kumamoto, Japan), Shingo Katsuki (Kumamoto, Japan), Ryohei Fujise (Kumamoto, Japan), Kenichirou Matsuyama (Kumamoto, Japan), Shinsuke Takaki (Kumamoto, Japan), Hiroyuki Iwaki (Tokyo), Hiroki Tadatomo (Tokyo) and Tomoya Onitsuka (Kumamoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing apparatus includes a first transfer path that is a transfer path for a substrate after MOR film formation and before exposure, and a second transfer path that is a transfer path...