US Patent Issued to Tokyo Electron on March 31 for "Deposition method and deposition apparatus" (Japanese Inventors)

ALEXANDRIA, Va., March 31 -- United States Patent no. 12,590,362, issued on March 31, was assigned to Tokyo Electron Ltd. (Tokyo).

"Deposition method and deposition apparatus" was invented by Katsumasa Yamaguchi (Yamanashi, Japan) and Tsubasa Yokoi (Yamanashi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A film deposition method includes preparing a substrate having an insulating film formed thereon, forming a seed layer on the insulating film, and supplying a molybdenum-containing gas and a reducing gas to the substrate having the seed layer famed thereon, to foam a molybdenum film on the seed layer."

The patent was filed on May 25, 2022, under Application No. 17/664,941.

*For further information,...