US Patent Issued to Tokyo Electron on March 24 for "Substrate processing method and substrate processing apparatus" (Japanese Inventors)

ALEXANDRIA, Va., March 24 -- United States Patent no. 12,588,461, issued on March 24, was assigned to Tokyo Electron Ltd. (Tokyo).

"Substrate processing method and substrate processing apparatus" was invented by Hiroki Sakurai (Koshi, Japan), Kazuki Kosai (Koshi, Japan) and Kazuyoshi Shinohara (Koshi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes: supplying a processing liquid to a center position of a substrate surface; shifting a supply position of the processing liquid from the center position to a first eccentric position; holding the supply position of the processing liquid at the first eccentric position and supplying a substitute liquid to a second eccentric position; shifting...