US Patent Issued to Tokyo Electron on March 17 for "Substrate processing apparatus and substrate processing method" (Japanese Inventors)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,578,650, issued on March 17, was assigned to Tokyo Electron Ltd. (Tokyo).

"Substrate processing apparatus and substrate processing method" was invented by Koji Ushimaru (Koshi, Japan), Kenji Iizuka (Koshi, Japan), Kei Miyazaki (Koshi, Japan) and Yukinobu Otsuka (Koshi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing apparatus includes a hot plate configured to support a substrate having a film formed thereon and perform a heat treatment of heating the substrate; a chamber configured to cover the substrate supported by the hot plate; a gas discharger, having a head member provided with multiple discharge holes distributed alo...