US Patent Issued to Tokyo Electron on June 23 for "Method of via filling" (New York Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,934, issued on June 23, was assigned to Tokyo Electron Ltd. (Tokyo).

"Method of via filling" was invented by Ryota Yonezawa (Albany, N.Y.), Kai-Hung Yu (Albany, N.Y.), Ying Trickett (Albany, N.Y.) and Hidenao Suzuki (Albany, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of processing a substrate includes exposing the substrate to a boron-containing precursor to adsorb over the substrate, where the substrate includes a dielectric layer formed over a conductive layer, and the conductive layer is exposed at a bottom of a recess formed in the dielectric layer. The method includes exposing the adsorbed boron-containing precursor to a plasm...