ALEXANDRIA, Va., June 2 -- United States Patent no. 12,646,693, issued on June 2, was assigned to Tokyo Electron Ltd. (Tokyo).
"Processing method and plasma processing apparatus" was invented by Kazuya Nagaseki (Miyagi, Japan), Kazuki Moyama (Miyagi, Japan), Shinji Himori (Miyagi, Japan), Masanobu Honda (Miyagi, Japan) and Satoru Teruuchi (Miyagi, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A processing method for performing plasma processing on a substrate includes placing a temperature adjustment target onto a support surface of a substrate support in a decompressible processing, forming a heat transfer layer by supplying, through the substrate support, a heat transfer medium including at least on...