US Patent Issued to Tokyo Electron on June 16 for "Substrate-processing method" (Japanese, American Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,654,198, issued on June 16, was assigned to Tokyo Electron Ltd. (Tokyo).

"Substrate-processing method" was invented by Daisuke Oba (Albany, N.Y.), Nobuo Matsuki (Yamanashi, Japan) and Yoshinori Morisada (Yamanashi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate-processing method includes a) forming a flowable oligomer on a substrate, the flowable oligomer containing carbon; and b) exposing the substrate to a plasma of a modification gas containing carbon and hydrogen, thereby modifying the flowable oligomer and forming a carbon-containing film."

The patent was filed on Oct. 18, 2024, under Application No. 18/920,078.

*For further inf...