US Patent Issued to Tokyo Electron on June 16 for "Apparatus and methods for processing bonding semiconductor wafers" (New York Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,525, issued on June 16, was assigned to Tokyo Electron Ltd. (Tokyo).

"Apparatus and methods for processing bonding semiconductor wafers" was invented by Satohiko Hoshino (Albany, N.Y.), Scott Lefevre (Albany, N.Y.) and Yuji Mimura (Albany, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for manufacturing semiconductor devices. The method includes placing a semiconductor wafer in a chamber. The method includes applying, in the chamber, a plasma that contains no fluorine. The plasma causes one or more components, in contact with the chamber, that each comprise a fluorinated coating to release its fluorine on a surface of the semiconductor...