US Patent Issued to Tokyo Electron on July 28 for "Systems and methods for bonding semiconductor devices" (Japanese Inventor)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,826, issued on July 28, was assigned to Tokyo Electron Ltd. (Tokyo).

"Systems and methods for bonding semiconductor devices" was invented by Sitaram Arkalgud (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for manufacturing semiconductor packages. The method includes providing a first semiconductor die including a plurality of metallization layers; completely overlaying a topmost one of the metallization layers with a barrier layer; completely overlaying the barrier layer sequentially with a stop layer and a laser liftoff layer; attaching a first side of the first semiconductor die to a first wafer through at least the laser liftoff l...