ALEXANDRIA, Va., July 28 -- United States Patent no. 12,693,639, issued on July 28, was assigned to Tokyo Electron Ltd. (Tokyo).

"System and method for substrate processing using models at multiple layers" was invented by Yuki Kataoka (Hokkaido, Japan) and Hironori Moki (Miyagi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A model management system, a model management method, and a model management program that efficiently manage models applied to a substrate manufacturing process is provided. The model management system separately manages the models applied to the substrate manufacturing process in three or more layers, and includes a first management unit configured to manage a model at a predeterm...