ALEXANDRIA, Va., July 21 -- United States Patent no. 12,689,009, issued on July 21, was assigned to Tokyo Electron Ltd. (Tokyo).
"Substrate transfer system and transfer module" was invented by Toshiaki Toyomaki (Miyagi, Japan), Norihiko Amikura (Miyagi, Japan), Seiichi Kaise (Miyagi, Japan) and Masatomo Kita (Miyagi, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "This substrate transfer system is provided with: a load-lock module; an atmospheric transfer module having a first sidewall, a second sidewall and a third sidewall, the first sidewall extending along a first direction and connected to the load-lock module, the second sidewall extending along a second direction perpendicular to the first direct...