US Patent Issued to Tokyo Electron on July 14 for "Wet processing system and nozzle for dispensing a liquid laterally across a semiconductor wafer" (New York Inventor)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,064, issued on July 14, was assigned to Tokyo Electron Ltd. (Tokyo).

"Wet processing system and nozzle for dispensing a liquid laterally across a semiconductor wafer" was invented by Ronald Nasman (Albany, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure provides improved wet processing systems and methods for processing a semiconductor wafer. More specifically, the present disclosure provides various embodiments of improved wet processing systems, liquid dispense nozzles and methods for dispensing a liquid that flows laterally across a surface of a semiconductor wafer with uniform flow velocity. The disclosed embodiments u...