US Patent Issued to Tokyo Electron on July 14 for "Substrate transfer device and substrate transfer method" (Japanese Inventor)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,679,668, issued on July 14, was assigned to Tokyo Electron Ltd. (Tokyo).

"Substrate transfer device and substrate transfer method" was invented by Takehiro Shindo (Yamanashi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate transfer device includes a tile-shaped section that includes a coil and a Hall element and that is provided in a transfer chamber, a transfer section that includes a permanent magnet and that is configured to move over the tile-shaped section to transfer a substrate, a temperature sensor configured to detect a temperature in the tile-shaped section, and a controller configured to estimate a position of the transfer se...