US Patent Issued to Tokyo Electron on July 14 for "Substrate processing method and substrate processing apparatus" (Japanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,068, issued on July 14, was assigned to Tokyo Electron Ltd. (Tokyo).

"Substrate processing method and substrate processing apparatus" was invented by Yuya Takamura (Iwate, Japan) and Masami Oikawa (Iwate, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed is a substrate processing method for processing a substrate in a processing vessel. In the substrate processing method, the following steps (a) through (d) are performed together (a) heating the substrate to a set processing temperature, (b) supplying deuterium into the processing vessel, (c) supplying oxygen into the processing vessel, and (d) discharging the deuterium and the oxygen i...