US Patent Issued to Tokyo Electron on July 14 for "Semiconductor devices and methods of manufacturing the same" (New York Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,055, issued on July 14, was assigned to Tokyo Electron Ltd. (Tokyo).

"Semiconductor devices and methods of manufacturing the same" was invented by Minjoon Park (Albany, N.Y.), Alec Dorfner (Albany, N.Y.), Matthew Ocana (Albany, N.Y.) and Andrew Metz (Albany, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes providing a semiconductor substrate having a first region and a second region. The method includes forming a stack of dielectric layers over the semiconductor substrate. The method includes patterning the stack to form first trenches over the first region and second trenches over the second region. The method further includes ...