US Patent Issued to Tokyo Electron on July 14 for "Bonding apparatus and bonding method" (Japanese Inventor)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,039, issued on July 14, was assigned to Tokyo Electron Ltd. (Tokyo).

"Bonding apparatus and bonding method" was invented by Hideyuki Fukushima (Koshi City, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A bonding apparatus includes a first holder, a second holder, a moving unit, a first transforming unit, a second transforming unit and a controller. The first holder holds a first substrate from above. The second holder is provided below the first holder, and holds a second substrate from below. The moving unit moves the first holder and the second holder relative to each other. The first transforming unit makes a central portion of the first s...