ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,562,349, issued on Feb. 24, was assigned to Tokyo Electron Ltd. (Tokyo).
"Substrate processing apparatus" was invented by Tetsuma Yaguchi (Miyagi, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing apparatus includes a plasma processing chamber configured to accommodate a substrate, and a ring assembly provided around the substrate and including a dielectric, and a potential generator disposed on the dielectric and formed of a conductive material. A lower surface of the potential generator is disposed at a position higher than an upper surface of the substrate. The substrate processing apparatus further includes a power supply c...