US Patent Issued to Tokyo Electron on Feb. 24 for "Semiconductor device manufacturing method and semiconductor device manufacturing system" (Japanese Inventor)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,563,984, issued on Feb. 24, was assigned to Tokyo Electron Ltd. (Tokyo).

"Semiconductor device manufacturing method and semiconductor device manufacturing system" was invented by Tatsuya Yamaguchi (Nirasaki City, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device manufacturing method includes: forming an organic film composed of a polymer having a urea bond in a recess by supplying amine and isocyanate to a surface of a substrate having the recess; performing a predetermined process on the substrate on which the organic film is formed in the recess; and removing the organic film in the recess by heating the substrate that has be...