ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,562,340, issued on Feb. 24, was assigned to Tokyo Electron Ltd. (Tokyo).
"Film forming method and film forming apparatus" was invented by Miyako Kaneko (Nirasaki, Japan), Takashi Hashizume (Nirasaki, Japan) and Naoko Suzuki (Nirasaki, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A film forming method includes: a supply operation of supplying a processing gas into a processing container in which a substrate is accommodated, the processing gas including a silicon-containing gas, a nitrogen-containing gas, and a diluent gas; and a film forming operation of plasmarizing the processing gas by supplying, into the processing container, power obtained b...