ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,555,758, issued on Feb. 17, was assigned to Tokyo Electron Ltd. (Tokyo).
"Film forming method and film forming device" was invented by Atsushi Shimada (Nirasaki, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "There is provided a film forming method for a film forming apparatus which includes: a processing chamber; a plurality of sputtering targets disposed in the processing chamber; and a plurality of magnets respectively disposed at the plurality of targets. The film forming method comprises: during a sputtering process in which a selected target selected among the plurality of targets is subjected to sputtering, performing a selected-side recipr...